BASE-METAL THICK-FILM HYBRIDS.

被引：0

作者：

Gainey, Trevor ^{[1
]}

机构：

[1] STC Components Ltd, STC Components Ltd

来源：

New Electronics | 1984年 / 17卷 / 20期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：53 / 54

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[21] SOLDER ATTACHMENT OF LEADED COMPONENTS TO THICK-FILM HYBRIDS
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IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 411 - 416
[22] THICK-FILM HYBRIDS MEET SATELLITE REQUIREMENTS .2.
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[23] THICK-FILM HYBRIDS MEET SATELLITE REQUIREMENTS .1.
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[24] THICK-FILM HYBRIDS IN LOW-NOISE AUDIO APPLICATIONS
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[25] EVALUATION OF SOLDER BUMP FLIP CHIPS IN THICK FILM SOLDER REFLOW HYBRIDS.
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[26] HYBRIDS FOR MICROWAVE GEAR GET BOOST FROM THICK-FILM TECHNOLOGY
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[27] NITROGEN-FIREABLE RESISTORS - EMERGING TECHNOLOGY FOR THICK-FILM HYBRIDS
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[28] FAILURE ANALYSIS TECHNIQUES APPLIED TO EPOXY ENCAPSULATED THICK-FILM HYBRIDS
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[29] STUDIES ON PRODUCTION OF FINE METAL POWDERS FOR THICK-FILM
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[30] THICK-FILM TECHNOLOGY
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