Nickel Plating: A New Surface Treatment for the Electrical Applications of Aluminum.

被引：0
|
作者：
Lefebvre, J.
机构：
来源：
Materiaux et Techniques | 1982年 / 70卷 / 9-10期
关键词：
D O I：
10.1051/mattech/198270090287
中图分类号：
学科分类号：
摘要：
A method of nickel plating aluminum is described which consists in ″activating″ the surface of the aluminum alloy by chemical treatment in a bath containing nickel chloride and then carrying out the nickel plating operation directly in a nickel sulfamate based bath, which makes it possible to obtain a pure deposit free of internal stresses. The characteristics of the nickel deposit thus obtained are described, the advantages of nickel plating bars in this manner are noted, and the possibility of extending this method to the plating of wires is indicated.
引用
收藏
页码：287 / 292
相关论文
共 50 条
  • [21] IMPROVED PROCESSES FOR ELECTROLESS NICKEL PLATING ON ALUMINUM
    HAJDU, J
    YARKOSKY, E
    SCHULTZ, P
    PLATING AND SURFACE FINISHING, 1983, 70 (11): : 45 - 45
  • [22] Electroless Nickel Plating of Aluminum Materials.
    Olbertz, B.
    MO Metalloberflache Beschichten von Metall und Kunststoff, 1988, 42 (06): : 279 - 280
  • [23] Characterization of electroless nickel plating on aluminum mirrors
    Folkman, SL
    Stevens, MS
    OPTOMECHANICAL DESIGN AND ENGINEERING 2002, 2002, 4771 : 254 - 264
  • [24] CLASSIFICATION OF IMPURITIES ACCORDING TO THEIR EFFECT ON INTERGRANULAR COHESION OF TITANIUM, NICKEL, AND ALUMINUM.
    Nikitina, N.V.
    Bolgova, G.V.
    Fedorova, E.G.
    Soviet physics journal, 1987, 30 (07): : 572 - 575
  • [25] Fabrication of nickel microbump on aluminum substrate using electroless nickel plating
    Watanabe, H.
    Honma, H.
    Transactions of the Institute of Metal Finishing, 1996, 74 (pt 4): : 138 - 141
  • [26] SURFACE TREATMENTS FOR ELECTROLESS NICKEL PLATING
    NARGI, CP
    GALVANOTECHNIK, 1981, 72 (07): : 736 - 736
  • [27] ADAPTIVE SPRAY - A NEW PROCESS FOR THIN GAUGE ALUMINUM.
    Reynolds, Jon
    Welding Journal (Miami, Fla), 1980, 59 (07): : 23 - 27
  • [28] A new family of nickel powder for electrical engineering applications
    Lucaci, M
    Gavriliu, S
    Lungu, M
    Simiti, IV
    Roman, I
    JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2004, 6 (03): : 947 - 950
  • [29] Direct nickel plating on aluminum substrate for microbumps fabrication
    Watanabe, H
    Honma, H
    1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 101 - 104
  • [30] Electroless Nickel Plating Process Optimization for Aluminum Terminals
    Westby, Philip
    Mattson, Kevin
    Haring, Fred
    Baer, Jacob
    Steele, Matt
    Ahmad, Syed Sajid
    Reinholz, Aaron
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 371 - 378
12345