Thermal conductivity study of porous low K dielectric materials

被引：0
|
作者：
Hu, Chuan [1 ]
Morgen, Michael [1 ]
Ho, Paul S. [1 ]
Jain, Anurag [2 ]
Gill, William N. [2 ]
Plawsky, Joel L. [2 ]
Wayner Jr., Peter C. [2 ]
机构：
[1] Institute for Materials Science, Univ. of Texas, Austin, TX 78712, United States
[2] Dept. of Chemical Engineering, Rensselaer Poly. Inst., Troy, NY 12180, United States
来源：
Materials Research Society Symposium - Proceedings | 1999年 / 565卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：87 / 92
相关论文
共 50 条
  • [1] Thermal conductivity study of porous low K dielectric materials
    Hu, C
    Morgen, M
    Ho, PS
    Jain, A
    Gill, WN
    Plawsky, JL
    Wayner, PC
    LOW-DIELECTRIC CONSTANT MATERIALS V, 1999, 565 : 87 - 92
  • [2] Thermal conductivity study of porous low-k dielectric materials
    Hu, C
    Morgen, M
    Ho, PS
    Jain, A
    Gill, WN
    Plawsky, JL
    Wayner, PC
    APPLIED PHYSICS LETTERS, 2000, 77 (01) : 145 - 147
  • [3] A Fractal Model for Effective Thermal Conductivity of Isotropic Porous Silica Low-k Materials
    Dong Xi-Jie
    Hu Yi-Fan
    Wu Yu-Ying
    Zhao Jun
    Wan Zhen-Zhu
    CHINESE PHYSICS LETTERS, 2010, 27 (04)
  • [4] Measurements of the thermal conductivity of amorphous materials with low dielectric constants
    Daly, BC
    Antonelli, GA
    Maris, HJ
    Ford, WK
    Wong, L
    Andideh, E
    PHYSICA B-CONDENSED MATTER, 2002, 316 : 254 - 257
  • [5] Temperature Dependence of Thermal Conductivity for Low-κ Dielectric Materials
    Ji, Chaoyue
    Wang, Shizhao
    Cai, Xintian
    Wang, Zhen
    Liu, Sheng
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [6] Advanced materials with low dielectric properties and highly thermal conductivity
    Ting, Wen-Pin
    Tseng, Feng-Po
    Chiou, Kuo-Chan
    2017 International Conference on Electronics Packaging, ICEP 2017, 2017, : 363 - 367
  • [7] THERMAL CONDUCTIVITY OF POROUS MATERIALS
    PAULIN, A
    MINING AND METALLURGY QUARTERLY, 1970, (01): : 69 - &
  • [8] Advanced Materials with Low Dielectric Properties and Highly Thermal Conductivity
    Ting, Wen-Pin
    Tseng, Feng-Po
    Chiou, Kuo-Chan
    2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 430 - 433
  • [9] Advanced Materials with Low Dielectric Properties and Highly Thermal Conductivity
    Ting, Wen-Pin
    Tseng, Feng-Po
    Chiou, Kuo-Chan
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 363 - 367
  • [10] Thermal conductivity of porous materials
    David S. Smith
    Arnaud Alzina
    Julie Bourret
    Benoît Nait-Ali
    Fabienne Pennec
    Nicolas Tessier-Doyen
    Kodai Otsu
    Hideaki Matsubara
    Pierre Elser
    Urs T. Gonzenbach
    Journal of Materials Research, 2013, 28 : 2260 - 2272
12345