'Correct by design' - as it impacts the printed circuit board

被引：0
|
作者：
Shore, P. [1 ]
机构：
[1] Accel Technologies
来源：
Electronic Engineering (London) | 1998年 / 70卷 / 861期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：65 / 74
相关论文
共 50 条
  • [41] PRINTED CIRCUIT BOARD PAD CRATER TEST METHODS AND SAMPLE DESIGN
    Embree, Todd
    Novita, Deassy
    Long, Gary
    Parupalli, Satish
    INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B, 2013, : 989 - 993
  • [42] INTEGRATION OF PRINTED CIRCUIT BOARD DESIGN SPOC IN ELECTRONIC ENGINEERING DEGREE
    Fernandez-Ros, M.
    Soler-Ortiz, M.
    Garcia, R. M.
    Castellano, N. N.
    Gazquez, J. A.
    12TH INTERNATIONAL CONFERENCE OF EDUCATION, RESEARCH AND INNOVATION (ICERI 2019), 2019, : 4537 - 4543
  • [43] The Effect of Conductor Roughness in High Speed Printed Circuit Board Design
    Bucur, Diana
    2014 11TH INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND TELECOMMUNICATIONS (ISETC), 2014,
  • [44] Optimization of Printed Circuit Board Design Assembly Using Yield Prediction
    Soukup, Radek
    2008 31ST INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: RELIABILITY AND LIFE-TIME PREDICTION, 2008, : 329 - 333
  • [45] Simple Design and Making of Double-Sided Printed Circuit Board
    Dai, Kun
    Yuan, Meng
    Xiang, Bo
    4TH INTERNATIONAL CONFERENCE ON MECHANICAL AUTOMATION AND MATERIALS ENGINEERING (ICMAME 2015), 2015, : 16 - 19
  • [46] Optimization Design of Printed Circuit Board Structure Based on Modal Analysis
    Zhang Weifen
    Li Yongmei
    Qian Ru
    PROCEEDINGS OF THE 2016 4TH INTERNATIONAL CONFERENCE ON ELECTRICAL & ELECTRONICS ENGINEERING AND COMPUTER SCIENCE (ICEEECS 2016), 2016, 50 : 1118 - 1123
  • [47] Design and characteristics of two Rogowski coils based on printed circuit board
    Chen Qing
    Li Hong-Bin
    Zhang Ming-Ming
    Liu Yan-Bin
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2006, 55 (03) : 939 - 943
  • [48] PROGRAMS FOR 2-SIDED PRINTED-CIRCUIT BOARD DESIGN
    ROSA, RC
    LUCIO, TP
    COMPUTER-AIDED DESIGN, 1979, 11 (05) : 297 - 303
  • [49] Printed Circuit Board Electrical Design for Wafer-Level Packaging
    Wu, Boping
    Mo, Tingting
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 141 - 144
  • [50] Design of coils on printed circuit board for inductive power transfer system
    Li, Zhenning
    He, Xiaoqiong
    Shu, Zeliang
    IET POWER ELECTRONICS, 2018, 11 (15) : 2515 - 2522
12345