Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation

被引:0
|
作者
Kim, P.G.
Jang, J.W.
Tu, K.N.
Frear, D.R.
机构
来源
Journal of Applied Physics | / 86卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Analysis of intermetallic compound formation in the reactions at liquid Ga/ solid Pd interface
    Kim, Byungwoo
    Sohn, Yoonchul
    SURFACES AND INTERFACES, 2022, 30
  • [32] THE OCCURRENCE OF INTERFACIAL TURBULENCE IN THE CASE OF DIFFUSION ACCOMPANIED BY CHEMICAL REACTION
    RUCKENSTEIN, E
    BERBENTE, C
    CHEMICAL ENGINEERING SCIENCE, 1964, 19 (05) : 329 - 347
  • [33] Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter
    Liu, Yingxia
    Chu, Ying-Ching
    Tu, K. N.
    ACTA MATERIALIA, 2016, 117 : 146 - 152
  • [34] Formation and growth behavior of intermetallic compound phases in the interfacial reaction of solid Fe / liquid Zn at 450 °C
    Han, Kwangsik
    Lee, Inho
    Ohnuma, Ikuo
    Kainuma, Ryosuke
    JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 888
  • [35] INTERFACIAL ENERGIES AND CHEMICAL COMPOUND FORMATION
    MCLEAN, M
    HONDROS, ED
    JOURNAL OF MATERIALS SCIENCE, 1973, 8 (03) : 349 - 351
  • [36] Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
    Zhang, Shawn
    Chen, Catherine
    Lee, Ricky
    IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2006, : 39 - 39
  • [37] INTERMETALLIC COMPOUND FORMATION IN Ni/Sn DIFFUSION COUPLE AT ATMOSPHERIC AND AT 10-8 ATMOSPHERE PRESSURE
    Adioui, N.
    Hannech, E. B.
    Guergueb, W.
    Bououdina, M.
    SURFACE REVIEW AND LETTERS, 2017, 24
  • [38] Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433 K
    T. Yamada
    K. Miura
    M. Kajihara
    N. Kurokawa
    K. Sakamoto
    Journal of Materials Science, 2004, 39 : 2327 - 2334
  • [39] Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433 K
    Yamada, T
    Miura, K
    Kajihara, M
    Kurokawa, N
    Sakamoto, K
    JOURNAL OF MATERIALS SCIENCE, 2004, 39 (07) : 2327 - 2334
  • [40] Kinetic study of a-Si crystallization induced by an intermetallic compound
    Moiseenko, Evgeny T.
    V. Yumashev, Vladimir
    Altunin, Roman R.
    Solovyov, Leonid A.
    Zharkov, Sergey M.
    VACUUM, 2025, 232