共 50 条
- [36] Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2006, : 39 - 39
- [38] Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433 K Journal of Materials Science, 2004, 39 : 2327 - 2334