Etching process of silicon dioxide with nonequilibrium atmospheric pressure plasma

被引：0
|
作者：
Yamakawa, Koji [1 ]
Hori, Masaru [2 ]
Goto, Toshio [1 ]
Den, Shoji [3 ]
Katagiri, Toshirou [3 ]
Kano, Hiroyuki [4 ]
机构：
[1] Department of Quantum Engineering, Nagoya University, Furo-Cho, Chikusa-ku, Nagoya 464-8603, Japan
[2] Department of Electrical Engineering and Computer Science, Nagoya University, Furo-Cho, Chikusa-ku, Nagoya 464-8603, Japan
[3] Department of Engineering, Katagiri Engineering Co., Ltd., Saiwai-ku, Kawasaki 661-8661, Japan
[4] NU-EcoEngineering Co., Ltd., Umazutsumi, Miyoshi-cho, Nishikamo-gun, Aichi 470-0201, Japan
来源：
Journal of Applied Physics | 2005年 / 98卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Plasma Jet etching at atmospheric pressure for semiconductor production
    Siniaguine, O
    1996 1ST INTERNATIONAL SYMPOSIUM ON PLASMA PROCESS-INDUCED DAMAGE, 1996, : 151 - 153
  • [42] Ion attachment mass spectrometry of nonequilibrium atmospheric-pressure pulsed remote plasma for SiO2 etching
    Iwasaki, Masahiro
    Ito, Masafumi
    Uehara, Tsuyoshi
    Nakamura, Megumi
    Hori, Masaru
    JOURNAL OF APPLIED PHYSICS, 2006, 100 (09)
  • [43] Ultrahigh-speed etching of organic films using microwave-excited nonequilibrium atmospheric-pressure plasma
    Yamakawa, K
    Hori, M
    Goto, T
    Den, S
    Katagiri, T
    Kano, H
    JOURNAL OF APPLIED PHYSICS, 2005, 98 (04)
  • [44] Ion attachment mass spectrometry of nonequilibrium atmospheric-pressure pulsed remote plasma for SiO2 etching
    Iwasaki, Masahiro
    Ito, Masafumi
    Uehara, Tsuyoshi
    Nakamura, Megumi
    Hori, Masaru
    Journal of Applied Physics, 2006, 100 (09):
  • [45] Plasma enhanced Chemical Vapour Deposition and plasma etching at atmospheric pressure
    Dani, Ines
    Hopfe, Volkmar
    Rogler, Daniela
    Lopez, Elena
    Maeder, Gerrit
    VAKUUM IN FORSCHUNG UND PRAXIS, 2006, 18 (04) : 30 - 33
  • [46] The preliminary study of etching characteristics of atmospheric pressure trifluoromethane plasma jet etching
    Sung, Yu-Ching
    Yang, Wen-Lin
    Huang, Chun
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2024, 63 (10)
  • [47] Afterglows in nonequilibrium reactive plasma flows near atmospheric pressure
    Naumov, VV
    Zhdanok, SA
    PHYSICA SCRIPTA, 1996, T63 : 295 - 296
  • [48] Afterglows in nonequilibrium reactive plasma flows near atmospheric pressure
    Phys Scr T, (295):
  • [49] Hydrogen plasma etching of silicon dioxide in a hollow cathode system
    Pena, O.
    Muhl, S.
    Lopez, W.
    Rodriguez-Fernandez, L.
    Ruvalcaba-Sil, J. L.
    THIN SOLID FILMS, 2010, 518 (12) : 3156 - 3159
  • [50] PLASMA-ETCHING OF SILICON AND SILICON DIOXIDE WITH HYDROGEN-FLUORIDE MIXTURES
    SMOLINSKY, G
    MAYER, TM
    TRUESDALE, EA
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (03) : C88 - C88
12345