Aluminum in Packaging - Why?.

被引:0
|
作者
Kasper, H.
机构
来源
Metallurgie (Mons, Belgium) | 1975年 / 15卷 / 01期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
Aluminum as modern packaging material is discussed in detail. Emphasis is placed on various applications in the food industry. The specific properties of aluminum which make it particularly well suited for this purpose are pointed out.
引用
收藏
页码:42 / 53
相关论文
共 50 条
  • [41] Aluminum-Scandium: A Material for Semiconductor Packaging
    Geissler, Ute
    Thomas, Sven
    Schneider-Ramelow, Martin
    Mukhopadhyay, Biswajit
    Lang, Klaus-Dieter
    JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (10) : 5456 - 5467
  • [42] Recovery and distribution of incinerated aluminum packaging waste
    Hu, Y.
    Bakker, M. C. M.
    de Heij, P. G.
    WASTE MANAGEMENT, 2011, 31 (12) : 2422 - 2430
  • [43] Aluminum-Scandium: A Material for Semiconductor Packaging
    Ute Geissler
    Sven Thomas
    Martin Schneider-Ramelow
    Biswajit Mukhopadhyay
    Klaus-Dieter Lang
    Journal of Electronic Materials, 2016, 45 : 5456 - 5467
  • [44] Corrosion performance of aluminum and stannum as beverage packaging
    Ismail A.
    Kar S.L.
    Ibrahim H.
    Ismail, A. (aazzura@uthm.edu.my), 2018, Trans Tech Publications Ltd (791) : 88 - 94
  • [45] CONTRIBUTION OF ALUMINUM FROM PACKAGING MATERIALS AND COOKING UTENSILS TO THE DAILY ALUMINUM INTAKE
    MULLER, JP
    STEINEGGER, A
    SCHLATTER, C
    ZEITSCHRIFT FUR LEBENSMITTEL-UNTERSUCHUNG UND-FORSCHUNG, 1993, 197 (04): : 332 - 341
  • [46] WHY ALUMINUM PHOSPHATE IS LESS TOXIC THAN ALUMINUM HYDROXIDE
    BERTHON, G
    DAYDE, S
    JOURNAL OF THE AMERICAN COLLEGE OF NUTRITION, 1992, 11 (03) : 340 - 348
  • [47] Aluminum Silicon Carbide (AlSiC) thermal management packaging for high density packaging applications
    Occhionero, MA
    Hay, RA
    Adams, RW
    Fennessy, KP
    1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS, 1999, 3830 : 34 - 39
  • [48] Embedded IC technology for compact packaging inside aluminum substrate (Pocket Embedded Packaging)
    Kim, Kyoung-Min
    Yook, Jong-Min
    Yeo, Sung-Ku
    Kwon, Young-Se
    2007 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-4, 2007, : 1125 - 1128
  • [49] Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded Packaging)
    Kim, Kyoung-Min
    Yook, Jong-Min
    Yeo, Sung-Ku
    Kwon, Young-Se
    2007 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, VOLS 1 AND 2, 2007, : 328 - 331
  • [50] Why is aluminum so difficult to plate?
    Altmayer, F
    PLATING AND SURFACE FINISHING, 2005, 92 (07): : 24 - 25