Thick-film Hybrid Circuits.

被引：0

作者：

Winiger, Franz

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来源：

| 1600年 / 51期

关键词：

Compendex;

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暂无

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学科分类号：

摘要：

INTEGRATED CIRCUITS, HYBRID

引用

共 50 条

[31] THICK-FILM HYBRID MICROCIRCUITS
KEISTER, FZ
AUDA, D
CERAMIC AGE, 1968, 84 (01): : 51 - &
[32] THICK-FILM AND THIN-FILM HYBRID CIRCUITS COMBINE CUSTOM, SEMICUSTOM TECHNIQUES
TRAVIS, B
EDN MAGAZINE-ELECTRICAL DESIGN NEWS, 1985, 30 (07): : 61 - &
[33] TECHNIQUES OF ADJUSTING THIN-FILM AND THICK-FILM RESISTORS IN HYBRID MICROELECTRONIC CIRCUITS
SINGH, A
MICROELECTRONICS AND RELIABILITY, 1976, 15 (02): : 123 - 129
[34] THICK-FILM NICKEL METALLIZATION FOR ELECTRONIC CIRCUITS
SHIH, TT
PUKAITE, CJ
AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 326 - 326
[35] REVERSE PHOTOLITHOGRAPHIC TECHNIQUE FOR THICK-FILM CIRCUITS
SINGH, A
PRUDENZIATI, M
MORTEN, B
MICROELECTRONICS AND RELIABILITY, 1985, 25 (01): : 61 - 63
[36] CONTROL FACTORS IN MANUFACTURE OF THICK-FILM CIRCUITS
RUSSELL, RF
MICROELECTRONICS RELIABILITY, 1968, 7 (02) : 121 - &
[37] The application of finite-element analysis in the design of thick-film hybrid circuits
Zarnik, MS
INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2002, 32 (01): : 14 - 21
[38] CHARACTERIZATION AND MODELING OF THICK-FILM COMPONENTS FOR HYBRID MICROWAVE-INTEGRATED CIRCUITS
AHMAD, M
RIAD, SM
RIAD, AAR
DAVIS, WA
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 1985, 34 (04) : 564 - 569
[39] PRECISION ETCHING OF THICK-FILM ALUMINUM CIRCUITS
WIESNER, HJ
PLATING AND SURFACE FINISHING, 1979, 66 (04): : 52 - 56
[40] PROGRESS IN MAKING TIN AND THICK-FILM CIRCUITS
HOCKADAY, CH
ELECTRONIC ENGINEERING, 1969, 41 (495): : 57 - &

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