Reliable and environmentally friendly packaging technology - flip-chip joining using anisotropically conductive adhesive

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Swedish Inst of Production, Engineering Research, Molndal, Sweden [1 ]
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IEEE Trans. Compon. Packag. Technol. | / 2卷 / 186-190期
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Manuscript received September 30; 1998; revised March 1; 1999. This paper was recommended for publication by Editor J. Morris upon evaluation of the reviewers’ comments. This paper was presented at the Third International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing; Binghamton; NY; September; 28–30; 1998. This work was supported in part by Ericsson Radio Systems and the National Swedish Governmental Board for Industrial and Technical Development (NUTEK); Environmentally Compatible Materials Research for Electronics Manufacturing (MMF) Research Program;
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