Technology to Die for

被引:0
|
作者
Bonawandt, Christian R.
机构
来源
Flexo | 2003年 / 28卷 / 05期
关键词
Costs; -; Cylinders; (shapes); Dies; Stamping;
D O I
暂无
中图分类号
学科分类号
摘要
Various aspects of the UniFlex Hot Stamp Rotary Dies are discussed. It is found that the UniFlex dies are only 30 to 40 % of the cost of solid rotary cylinders and are lightweight. UniFlex dies are found to be safer to handle and easier to store. The turnaround time for UniFlex dies is found to be one or two days as compared to four to five days for a solid cylinder.
引用
收藏
页码:110 / 112
相关论文
共 50 条
  • [41] EPOXY DIE MOUNTING AND MICROELECTRONICS: A NEW TECHNOLOGY.
    Kulesza, Frank W.
    1973, : 77 - 79
  • [42] Study on the computer modeling technology of die design and engineering
    1600, Trans Tech Publications Ltd (670):
  • [43] Computer Aided Design of Technology and Die for the Shoe Toe
    Fan, Xiaohong
    Yuan, Zhengjun
    Li, Jing
    Xu, Bin
    MECHANICS, SOLID STATE AND ENGINEERING MATERIALS, 2011, 279 : 266 - 270
  • [44] Burn-in Screening Technology of Power Bare Die
    Huang Yun
    Yang Shaohua
    En Yunfei
    Feng Yongjie
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1255 - 1258
  • [45] Extrusion die technology in the manufacture of sheets and films.
    Gross, H
    KUNSTSTOFFE-PLAST EUROPE, 1997, 87 (11): : 1600 - +
  • [46] Modern medical technology: Sometimes it's cheaper to die
    Khol, R
    MACHINE DESIGN, 1997, 69 (12) : 6 - 6
  • [47] The Warpage and Thermal Simulation Study for Embedded Die Technology
    Chen, Tang-Yuan
    Chen, Bo-Syun
    Yang, Penny
    Lai, Jin-Yuan
    Shih, MengKai
    2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2016, : 161 - 162
  • [48] Virtual die tryout technology for sheet metal forming
    Zeng, Qi
    Qi, Tian
    Chinese Journal of Mechanical Engineering (English Edition), 2002, 15 (SUPPL.): : 32 - 34
  • [49] Study on Stretching Effect of Multiple Die Forming Technology
    Park, Ji-Woo
    Kim, Jeong
    Kang, Beom-soo
    NUMISHEET 2014: THE 9TH INTERNATIONAL CONFERENCE AND WORKSHOP ON NUMERICAL SIMULATION OF 3D SHEET METAL FORMING PROCESSES: PART A BENCHMARK PROBLEMS AND RESULTS AND PART B GENERAL PAPERS, 2013, 1567 : 975 - 978
  • [50] Embedded die technology breakthrough: The redistributed chip package
    Keser, Beth
    Amrine, Craig
    Leal, George
    Lytle, William
    Mitchell, Doug
    Wenzel, Robert
    Journal of Japan Institute of Electronics Packaging, 2008, 11 (04) : 280 - 284