Low-temperature dry etching of copper using a new chemical approach

被引：0

作者：

Kruck, Th. ^{[1
]}

Schober, M. ^{[1
]}

机构：

[1] Universitaet zu Koeln, Koeln, Germany

来源：

Microelectronic Engineering | 1997年 / 37-38卷

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摘要：

引用

页码：121 / 126

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