Power Supply Conductors for Fast Integrated Circuits and Multilayer Boards.

被引：0

作者：

Langer, Inge

机构：

来源：

Nachrichtentechnik Elektronik | 1976年 / 26卷 / 02期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUIT MANUFACTURE

引用

页码：74 / 76

共 50 条

[1] EFFECTS OF INTEGRATED CIRCUITS ON USAGE TRENDS FOR PRINTED CIRCUIT BOARDS.
Dicken, Howard K.
Insulation, circuits, 1980, 26 (09): : 37 - 39
[2] POWER SUPPLY CONSTRUCTION FOR USE ON PRINTED CIRCUIT BOARDS.
Henley, B.L.
Joy, E.F.
Nealy, J.C.
Wheeler, W.R.
IBM technical disclosure bulletin, 1983, 26 (04): : 1853 - 1854
[3] LASER DRILLING OF PRINTED CIRCUITS BOARDS.
Watson, M.N.
Circuit World, 1984, 11 (01) : 13 - 17
[4] Plasma Desmearing of Multilayer Printed Circuit Boards.
Kegel, Bert
Naversnik, Rudolf
MO Metalloberflache Beschichten von Metall und Kunststoff, 1987, 41 (11): : 521 - 525
[5] MEASURING THE DEGREE OF CURE OF MULTILAYER CIRCUIT BOARDS.
Sanjana, Z.N.
Sampson, R.N.
Burstein, E.B.
Insulation, circuits, 1981, 27 (04): : 87 - 92
[6] LEVELING OF COPPER PLATING IN MULTILAYER PC BOARDS.
Boccia, Louis J.
1978, 18 (12): : 40 - 42
[7] DENSE, FAST CIRCUITS DEMAND MULTILAYER BOARDS TO MEET THEIR NEEDS
WINARD, H
ELECTRONIC DESIGN, 1985, 33 (19) : 51 - &
[8] EXTENDED LAYERING ALGORITHM FOR MULTILAYER PRINTED WIRING BOARDS.
Ghameshlu, Mohsen
Yoshida, Noriyoshi
Transactions of the Institute of Electronics, Information and Communication Engineers, Section E (, 1987, E70 (10): : 906 - 908
[9] QUALITY IMPROVEMENT BY VACUUM LAMINATING OF COMPLEX MULTILAYER BOARDS.
Mueller, G.
Circuit World, 1985, 12 (01) : 22 - 25
[10] Currentless Copper Plating of Multilayer Printed Circuit Boards.
Beier, Ernst
Elektronikpraxis, 1980, 15 (12): : 76 - 79