LASER DRILLING OF PRINTED CIRCUITS BOARDS.

被引：7

作者：

Watson, M.N.

机构：

来源：

关键词：

D O I：

10.1108/eb043747

中图分类号：

学科分类号：

摘要：

引用

页码：13 / 17

共 50 条

[1] Printed Circuit Boards.
Taubitz, Gerhard
Elektronik Munchen, 1983, 32 (21): : 90 - 116
[2] EFFECTS OF INTEGRATED CIRCUITS ON USAGE TRENDS FOR PRINTED CIRCUIT BOARDS.
Dicken, Howard K.
Insulation, circuits, 1980, 26 (09): : 37 - 39
[3] ROUTING OF PRINTED CIRCUIT BOARDS.
Aranoff, S.
Abulaffio, Y.
Proceedings - Design Automation Conference, 1981, : 130 - 136
[4] NEW PRINTED CIRCUIT BOARDS.
Yanagihara, Kohtaro
Gaku, Morio
Sugie, Soji
1600, (08):
[5] Novel Compact Construction Techniques of Drilling and Cutting Machines for Printed Circuit Boards.
Gerlach, B.
Elektronik Produktion & Prueftechnik, 1981, (11): : 644 - 646
[6] Coating Varnishes for Printed Circuit Boards.
Olesen, S.T.
Villien, P.
Willumsen, A.
Elektronikcentralen (Report) ECR, 1979, (88):
[7] Inductive Soldering of Printed Circuit Boards.
Wolf, Hans-Juergen
ZIS Mitteilungen, 1973, 15 (04): : 413 - 418
[8] Testing LSI Printed Circuit Boards.
Poehlmann, Bernd
Giesbrecht, Dieter
Messen und Pruefen, 1979, 15 (03): : 117 - 120
[9] DESIGN PROCEDURE FOR PRINTED WIRING BOARDS.
Davis, R.A.
American Society of Mechanical Engineers (Paper), 1977, (77 -DET-110):
[10] IRON CORE PRINTED WIRING BOARDS.
Matsuyama, Kentaro
Tabei, Hisao
Tanaka, Akinobu
Nara, Shigeo
1600, (26): : 7 - 8