LASER DRILLING OF PRINTED CIRCUITS BOARDS.

被引：7

作者：

Watson, M.N.

机构：

来源：

关键词：

D O I：

10.1108/eb043747

中图分类号：

学科分类号：

摘要：

引用

页码：13 / 17

共 50 条

[41] Chip Implementation on Hybrid Circuits and Printed Wiring Boards. Use of Automatic Machinery Constructed of Modules.
Friedrich, D.
Elektronik Produktion & Prueftechnik, 1981, (10): : 531 - 535
[42] POWER SUPPLY CONSTRUCTION FOR USE ON PRINTED CIRCUIT BOARDS.
Henley, B.L.
Joy, E.F.
Nealy, J.C.
Wheeler, W.R.
IBM technical disclosure bulletin, 1983, 26 (04): : 1853 - 1854
[43] ADDITIVE METHODS FOR PRODUCTION OF PRINTED-CIRCUIT BOARDS.
Kalikhman, V.L.
Khas'kin, O.S.
Soviet electrical engineering, 1979, 50 (04): : 72 - 76
[44] Automatic Adjustment Associated with Testing of Printed Circuit Boards.
Muehlbauer, H.
Elektronik Produktion & Prueftechnik, 1987, (09): : 23 - 24
[45] ELECTROMECHANICAL RELAYS GAINING SPACE ON PRINTED CIRCUIT BOARDS.
MORRIS, HENRY M.
1982, V 29 (N 12): : 78 - 79
[46] HIGH DENSITY METAL CORE PRINTED WIRING BOARDS.
Sato, Takao
Morisaki, Genji
Kikuchi, Hideo
NEC Research and Development, 1979, (54): : 14 - 19
[47] FLUXES FOR MASS-SOLDERING PRINTED CIRCUIT BOARDS.
WILLUMSEN, A.
1981,
[48] ASSEMBLING 963 BELLPAC CONNECTORS TO PRINTED WIRING BOARDS.
Kleinedler, Gary E.
Foster, William L.
Deckard, Gerald T.
Engineer (New York), 1983, 27 (03): : 22 - 27
[49] ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS.
Carano, Michael
Electri-onics, 1986, 32 (03): : 29 - 32
[50] LASER DRILLING OF HIGH-DENSITY PRINTED-CIRCUIT BOARDS
KLAUSER, HE
IEEE JOURNAL OF QUANTUM ELECTRONICS, 1981, 17 (12) : 160 - 160