SURVEYING SEMICONDUCTOR DEVICE MATERIALS.

被引：0
|
作者：
Markstein, Howard W.
机构：
来源：
Electronic Packaging and Production | 1973年 / 13卷 / 03期
关键词：
INTEGRATED CIRCUIT MANUFACTURE - SEMICONDUCTOR MATERIALS;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
For device manufacturers to complete in today's dynamic market requires continual improvements in both technology and available materials. A state-of-the-art report is presented including recent developments of encapsulants, dopants, thin films, thick films and substrates.
引用
收藏
页码：25 / 33
相关论文
共 50 条
  • [31] DEVICE FOR MEASURING THERMAL EMF OF SEMICONDUCTOR-MATERIALS
    LYASHCHENOK, VI
    PLEKHOTKINA, GL
    STREKOPYTOVA, NI
    INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 1976, 19 (05) : 1568 - 1569
  • [32] Characterisation of Semiconductor Materials/Device Structures using SIMS
    Dhaul, Anuradha
    Sharma, S. K.
    Sharma, R. K.
    Kapoor, A. K.
    DEFENCE SCIENCE JOURNAL, 2009, 59 (04) : 342 - 350
  • [33] Characterization of charging in semiconductor device materials by electron holography
    McCartney, MR
    JOURNAL OF ELECTRON MICROSCOPY, 2005, 54 (03): : 239 - 242
  • [34] Nanoimprint Lithography Materials Development for Semiconductor Device Fabrication
    Costner, Elizabeth A.
    Lin, Michael W.
    Jen, Wei-Lun
    Willson, C. Grant
    ANNUAL REVIEW OF MATERIALS RESEARCH, 2009, 39 : 155 - 180
  • [35] BRAZING MATERIALS.
    Purkayastha, R.
    1600, (04):
  • [36] SENSOR MATERIALS.
    Duckworth, W.E.
    Materials and Design, 1988, 9 (02): : 72 - 77
  • [37] Refractory materials.
    不详
    NATURE, 1917, 98 : 281 - 281
  • [38] The strength of materials.
    Voigt, W
    ZEITSCHRIFT DES VEREINES DEUTSCHER INGENIEURE, 1901, 45 : 1033 - 1035
  • [39] The testing of materials.
    不详
    NATURE, 1908, 77 : 404 - 404
  • [40] TOOL MATERIALS.
    Coleman, John R.
    Tooling and production, 1983, 49 (05): : 19 - 24
12345