Aerosol Valve - More than a Means for Packaging.

被引：0
|
作者：
Tauscher, Wolfgang
机构：
来源：
Verpackungs - Rundschau | 1973年 / 24卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The author uses this heading to describe and to deal with the function of the technological unit obeying physical flow laws. He discusses the long time resistance and permanent use function of a valve/spray head system as well as corrosion behavior and vapor phase hole characteristics. Correct choice of the aerosol system and valve techniques contributes to optimization of life and function of an aerosol unit.
引用
收藏
页码：861 / 862
相关论文
共 50 条
  • [21] Sterilization of Packages in Aseptic Packaging.
    Cerny, Gerhard
    Verpackungs - Rundschau, 1977, 28 (10): : 77 - 82
  • [22] BACKPANEL DESIGN: AN EVOLUTION IN PACKAGING.
    Markstein, Howard W.
    Electronic Packaging and Production, 1974, 14 (11):
  • [23] Trends in area array packaging.
    Goodman, TW
    Vardaman, EJ
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1996, 211 : 195 - POLY
  • [24] Packaging. Reduce, recycle, or what?
    Miller, Chaz
    Waste Age, 1994, 25 (02):
  • [25] HEAT PIPES IN ELECTRONIC PACKAGING.
    Basiulis, A.
    Sekhon, K.S.
    1978, 18 (11): : 126 - 133
  • [26] Clear PPO in microwave packaging.
    不详
    MODERN PLASTICS, 2000, 77 (05): : 133 - 133
  • [27] Barrier coatings for food packaging.
    Lopata, ES
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 213 : 494 - POLY
  • [28] Highly transparent PP packaging.
    Schlotmann, R
    KUNSTSTOFFE-PLAST EUROPE, 1998, 88 (06): : 868 - 869
  • [29] TOLERANCE ANALYSIS IN ELECTRONIC PACKAGING.
    Velsher, B.
    Electronic Packaging and Production, 1987, 27 (04): : 76 - 78
  • [30] HIGH DENSITY ELECTRONICS PACKAGING.
    Schwartz, Walter H.
    Assembly engineering, 1988, 31 (02): : 30 - 33
12345