MEETING THE CHALLENGE OF FINE LINE CIRCUIT BOARDS IN THE EIGHTIES.

被引:0
|
作者
Siegmund, A.J.
机构
来源
关键词
Compendex;
D O I
10.1080/00202967.1983.11870638
中图分类号
学科分类号
摘要
Printed circuits
引用
收藏
页码:57 / 59
相关论文
共 50 条
  • [21] MEASURE IONIC CONTAMINATION LEVEL ON ASSEMBLED PRINTED CIRCUIT BOARDS - ON THE PRODUCTION LINE.
    Anon
    Insulation/Circuits, 1975, 21 (13): : 42 - 43
  • [22] On the Use of a Microstrip Meander Line to Reduce Mutual Coupling between a Patch Antenna and a Transmission Line on Printed Circuit Boards
    Islam, Tania
    Nusrat, Tasin
    Roy, Sayan
    2022 IEEE USNC-URSI RADIO SCIENCE MEETING (JOINT WITH AP-S SYMPOSIUM), 2022, : 52 - 53
  • [23] Just in time cleaning improves the yields in fine line circuit manufacture
    Hamilton, S.
    Circuit World, 1990, 16 (02) : 38 - 40
  • [24] Influence of signal line length and ground plane dimensions on radiation emission of printed circuit boards
    Oka, N
    Miyazaki, C
    Uchida, T
    Nitta, S
    ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 2000, 83 (03): : 53 - 61
  • [25] Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards
    Wang, Fangfang
    Zhao, Yuemin
    Zhang, Tao
    Duan, Chenlong
    Wang, Lizhang
    WASTE MANAGEMENT, 2015, 43 : 434 - 441
  • [26] Influence of signal line length and ground plane dimensions on radiation emission of printed circuit boards
    Oka, Naoto
    Miyazaki, Chiharu
    Uchida, Takeshi
    Nitta, Shuichi
    Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), 2000, 83 (03): : 53 - 61
  • [27] Equivalent Transmission-Line Model for Vias Connected to Striplines in Multilayer Print Circuit Boards
    Pan, Siming
    Zhang, Jianmin
    Chen, Qinghua B.
    Fan, Jun
    2010 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC 2010), 2010, : 455 - 460
  • [28] Metals recovery from dust derived from recycling line of waste printed circuit boards
    Wang, Fangfang
    Zhao, Yuemin
    Zhang, Tao
    Zhang, Guangwen
    Yang, Xing
    He, Yaqun
    Wang, Lizhang
    Duan, Chenlong
    JOURNAL OF CLEANER PRODUCTION, 2017, 165 : 452 - 457
  • [29] Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model
    Pan, Siming
    Fan, Jun
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2012, 54 (05) : 1077 - 1086
  • [30] Modeling double-side printed meander-line inductors on printed circuit boards
    Acuña, JE
    Rodriguez, JL
    Obelleiro, F
    INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, 2003, 13 (02) : 105 - 112