Copper grain boundary diffusion in electroless deposited cobalt based films and its influence on diffusion barrier integrity for copper metallization

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[1] Kohn, A.
[2] Eizenberg, M.
[3] Shacham-Diamand, Y.
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Kohn, A. (mtamit@techunix.technion.ac.il) | 1600年 / American Institute of Physics Inc.卷 / 94期
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