Electrodeposited copper foil for fine pattern

被引：0
|
作者：
Nakaoka, Tadao [1 ,2 ]
机构：
[1] Circuit Foil Japan, Imaichi City, Tochigi-ken, Japan
[2] R and D Department
来源：
Transactions of the Institute of Metal Finishing | 2000年 / 78卷 / 04期
关键词：
Adhesion - Copper - Electrodeposition - Printed circuit boards - Surface roughness - Surface treatment;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The small surface roughness of the matte side is the first requirement of the electrodeposited copper foil for the fine pattern. In order to meet the requirement, mass production of the raw foil, which has an unprecedented extremely flat matte side in the electrodeposited copper foil, was realized. Also, adhesion to resin is required of the copper foil for the printed circuit board as its other feature, thus matte side treatment and surface treatment were also reviewed.
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