Process integration, architecture and simulation of a GHz-BiCMOS ULSI technology

被引:0
|
作者
Dwivedi, V.K. [1 ]
Singh, N.B. [1 ]
Pyne, D. [1 ]
Johri, S. [1 ]
Virdi, G.S. [1 ]
机构
[1] Central Electronics Engineering, Research Inst, Pilani, India
关键词
Application specific integrated circuits (ASICs) - Device simulator SEDAN - Inhouse device simulator MOSKIT - Process simulator SUPREM;
D O I
10.1016/0026-2692(93)90022-7
中图分类号
学科分类号
摘要
引用
收藏
页码:773 / 785
相关论文
共 50 条
  • [1] PROCESS INTEGRATION ISSUES FOR SUBMICRON BICMOS TECHNOLOGY
    HAVEMANN, RH
    EKLUND, RH
    SOLID STATE TECHNOLOGY, 1992, 35 (06) : 71 - 76
  • [2] An advanced 0.25-μm BiCMOS process integration technology for multi-GHz communication LSIs
    Kinoshita, Y
    Suzuki, H
    Nakamura, S
    Fukaishi, M
    Tajima, A
    Suemura, Y
    Itani, T
    Miyamoto, H
    Fujii, H
    Yotsuyanagi, M
    Henmi, N
    Yamazaki, T
    PROCEEDINGS OF THE 1997 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 1997, : 72 - 75
  • [3] BICMOS PROCESS TECHNOLOGY
    OHMI, T
    KAWANO, K
    YOSHIDA, T
    OTOWA, Y
    SAKAMOTO, Y
    YAMAGUCHI, H
    NAKAI, T
    MINAKUCHI, Y
    SHARP TECHNICAL JOURNAL, 1988, (40): : 66 - 70
  • [4] PROCESS INTEGRATION TECHNOLOGY FOR LOW PROCESS COMPLEXITY BICMOS USING TRENCH COLLECTOR SINK
    YOSHIDA, H
    SUZUKI, H
    KINOSHITA, Y
    IMAI, K
    AKIMOTO, T
    TOKASHIKI, K
    NEC RESEARCH & DEVELOPMENT, 1995, 36 (03): : 376 - 382
  • [5] The Integration of Process Simulation Within the Business Architecture
    Roelens, Ben
    Tierens, Louise
    ENTERPRISE, BUSINESS-PROCESS AND INFORMATION SYSTEMS MODELING, 2022, 450 : 188 - 202
  • [6] Aspects of submicron BiCMOS technology integration
    Wachmann, E
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 1997, 27 (04): : 239 - 245
  • [7] Numerical simulation for ULSI manufacturing process
    Hiyama, Hirokuni
    Wang, Xinming
    Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 2008, 74 (05): : 435 - 440
  • [8] 200 GHz Interconnects for InP-on-BiCMOS Integration
    Ostermay, I.
    Schmueck, F. -J.
    Doerner, R.
    Thies, A.
    Heinrich, W.
    Krueger, O.
    Krozer, V.
    Jensen, T.
    Kraemer, T.
    Lisker, M.
    Trusch, A.
    Matthus, E.
    Borokhovych, Y.
    Tillack, B.
    2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS), 2013,
  • [9] 2 GHz RF circuits in BiCMOS process
    Fournier, JM
    Senn, P
    ANALOG CIRCUIT DESIGN: MOST RF CIRCUITS, SIGMA-DELTA CONVERTERS AND TRANSLINEAR CIRCUITS, 1996, : 39 - 61
  • [10] On-chip integration of dipole antenna and VCO using standard BiCMOS technology for 10 GHz applications
    Touati, F
    Pons, M
    ESSCIRC 2003: PROCEEDINGS OF THE 29TH EUROPEAN SOLID-STATE CIRCUITS CONFERENCE, 2003, : 493 - 496