共 50 条
- [41] On the thermal expansion of CNT/Cu composites for electronic packaging applications APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2013, 111 (02): : 439 - 443
- [42] On the thermal expansion of CNT/Cu composites for electronic packaging applications Applied Physics A, 2013, 111 : 439 - 443
- [43] METAL-MATRIX COMPOSITE PACKAGING OF MICROWAVE CIRCUITRY GEC JOURNAL OF RESEARCH, 1994, 11 (03): : 150 - 166
- [45] Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications Journal of Materials Science, 2000, 35 : 6231 - 6236
- [46] Deformation and damage in metal-matrix composites METAL AND CERAMIC MATRIX COMPOSITES, 2004, : 203 - 221
- [49] THE ROLE OF INTERFACES IN METAL-MATRIX COMPOSITES JOURNAL OF METALS, 1987, 39 (07): : A58 - A58