Advanced copper column based solder bump for flip chip interconnection

被引：0
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作者：
Yamada, Hiroshi [1 ]
Togasaki, Takashi [1 ]
Tateyama, Kazuki [1 ]
Higuchi, Kazuhito [1 ]
机构：
[1] Toshiba Corp, Yokohama, Japan
来源：
International Journal of Microcircuits and Electronic Packaging | / 21卷 / 01期
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页码：15 / 21
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