Electroless plating for bump and flip-chip technology

被引：0
|
作者：
Bruton, G.
Morissey, A.
机构：
来源：
| 1995年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology
    Du, Junhao
    Zhao, Xuewei
    Su, Jiale
    Li, Ben
    Duan, Xiangliang
    Dong, Tianyu
    Lin, Hongxiao
    Ren, Yuhui
    Miao, Yuanhao
    Radamson, Henry H.
    SENSORS, 2025, 25 (01)
  • [22] Stud Bump Process for Flip-chip Research Improve UPH of Stud Bump
    Zheng Zhirong
    Cui Song
    Ma Lixin
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 6 - 10
  • [23] Novel micro-bump fabrication for flip-chip bonding
    Takao Ishii
    Shinji Aoyama
    Journal of Electronic Materials, 2004, 33 : L21 - L23
  • [24] Electromigration failures of UBM/bump systems of flip-chip packages
    Wu, JD
    Zheng, PJ
    Lee, K
    Chiu, CT
    Lee, JJ
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 452 - 457
  • [25] Development of Inclined Conductive Bump (ICB) for Flip-Chip Interconnection
    Park, Ah-Young
    Kim, Sun-Rak
    Yoo, Choong D.
    Kim, Taek-Soo
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 880 - 885
  • [26] A Study of Flip-chip Open Solder Bump Failure Mechanism
    Wang, Zhaofeng
    Choudhry, Mahmood
    ISTFA 2006, 2006, : 239 - 242
  • [27] Lead-free bump interconnections for flip-chip applications
    Karim, ZS
    Schetty, R
    TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS, 2000, : 274 - 278
  • [28] Investigation of under bump metallization systems for flip-chip assemblies
    Teo, PS
    Huang, YW
    Tung, CH
    Marks, MR
    Lim, TB
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 33 - 39
  • [29] Flip-Chip Process Using Interlocking-Bump Joints
    Oh, Tae-Sung
    Lee, Kwang-Yong
    Won, Hye-Jin
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (04): : 909 - 914
  • [30] Studies on a novel flip-chip interconnect structure - Pillar bump
    Wang, T
    Tung, F
    Foo, L
    Dutta, V
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 945 - 949
12345