Energy approach to the fatigue of 60/40 solder: Part I - influence of temperature and cycle frequency

被引:0
|
作者
Solomon, H.D. [1 ]
Tolksdorf, E.D. [1 ]
机构
[1] GE R&D Cent, Schenectady, United States
来源
Journal of Electronic Packaging, Transactions of the ASME | 1995年 / 117卷 / 02期
关键词
Correlation theory - Crack propagation - Fatigue of materials - Hysteresis - Strain - Transducers;
D O I
暂无
中图分类号
学科分类号
摘要
This study correlates previously published fatigue life data with the hysteresis energy, and compares this to the previous correlation's with the applied plastic strain. It was found that, while the hysteresis energy could be used to describe the fatigue life, corrections must be made to account for the temperature and strain rate dependence of the flow stress. Because of these factors, it is believed that the plastic strain, and not the hysteresis energy, is the true governing factor in determining the fatigue life. Part I (described here) covers only the influence of temperature and cycle frequency for symmetric cycling. Part II, to be published, will deal with hold time and asymmetric cycling.
引用
收藏
页码:130 / 135
相关论文
共 50 条
  • [41] Influence of Tempering Temperature on Low Cycle Fatigue of High Strength Steel
    Kwon, Hyuksun
    Barlat, Frederic
    Lee, Myounggyu
    Chung, Younil
    Uhm, Sangho
    ISIJ INTERNATIONAL, 2014, 54 (04) : 979 - 984
  • [42] Elevated temperature low-cycle fatigue behavior of HK40 alloy
    Konosu, S.
    Fatigue and Fracture of Engineering Materials and Structures, 1994, 17 (06): : 683 - 693
  • [43] SAC 305 solder paste with carbon nanotubes - part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties
    Bukat, K.
    Sitek, J.
    Koscielski, M.
    Jakubowska, M.
    Sloma, M.
    Mlozniak, A.
    Niedzwiedz, W.
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2012, 24 (04) : 267 - 279
  • [44] Low cycle fatigue life prediction based on energy density approach
    Chen, L
    Fan, ZC
    Jiang, JL
    ENVIRONMENT EFFECTS ON FRACTURE AND DAMAGE, 2004, : 117 - 122
  • [45] Influence of the Loading Frequency on Very High Cycle Fatigue Behavior of Structural Steels
    Teixeira, M. C.
    Awd, M.
    Walther, F.
    Pereira, M. V.
    FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES, 2025, 48 (02) : 751 - 763
  • [46] Microstructure coarsening during static annealing of 60Sn40Pb solder joints: I stereology
    Kang Jung
    Hans Conrad
    Journal of Electronic Materials, 2001, 30 : 1294 - 1302
  • [47] HIGH-TEMPERATURE, LOW-CYCLE FATIGUE OF IN-100 SUPERALLOY .1. INFLUENCE OF TEMPERATURE ON THE LOW-CYCLE FATIGUE BEHAVIOR
    REGER, M
    REMY, L
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1988, 101 : 47 - 54
  • [48] High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach
    Thambi, J.
    Tetzlaff, U.
    Schiessl, A.
    Lang, K-D
    Waltz, M.
    MICROELECTRONICS RELIABILITY, 2016, 66 : 98 - 105
  • [49] Experimental investigation of temperature and mean stress effects on high cycle fatigue behavior of SnAgCu-solder alloy
    Maniar, Youssef
    Konstantin, Georg
    Kabakchiev, Alexander
    Binkele, Peter
    Schmauder, Siegfried
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1651 - 1658
  • [50] Strain range fatigue life assessment of lead-free solder interconnects subject to temperature cycle loading
    Osterman, Michael
    Pecht, Michael
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2007, 19 (02) : 12 - 17