Study on the mechanisms of chemical mechanical polishing on copper and aluminum surfaces employing in situ infrared spectroscopy

被引:0
|
作者
机构
[1] Ogawa, Hiroki
[2] Tokuyama, Yusuke
[3] Yanagisawa, Michihiko
[4] Nakagawa, Hideo
[5] Kikuchi, Jun
[6] Horiike, Yasuhiro
来源
Ogawa, H. (ogawa@micro.mm.t.u-tokyo.ac.jp) | 1600年 / Japan Society of Applied Physics卷 / 42期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Silicon nitride chemical mechanical polishing mechanisms
    Hu, YZ
    Gutmann, RJ
    Chow, TP
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (11) : 3919 - 3925
  • [32] Kinetics of polishing friction for copper pits formation during copper chemical mechanical polishing
    Wang, Ying-Lang
    Chen, Kei-Wei
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2007, 154 (07) : H589 - H595
  • [33] Influence of process parameters on polishing rate of copper in chemical mechanical polishing
    Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China
    Run Hua Yu Mi Feng, 2006, 7 (113-114+119):
  • [34] Characteristics in chemical-mechanical polishing of copper: Comparison of polishing pads
    Stavreva, Z
    Zeidler, D
    Plotner, M
    Drescher, K
    APPLIED SURFACE SCIENCE, 1997, 108 (01) : 39 - 44
  • [35] The mechanical effect of soft pad on copper chemical mechanical polishing
    Liu, Pengzhan
    Nam, Yuna
    Lee, Seunghwan
    Kim, Eungchul
    Jeon, Sanghuck
    Park, Kihong
    Hong, Seokjun
    Kim, Taesung
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2023, 155
  • [36] Tribological Aspects of Chemical Mechanical Polishing Diamond Surfaces
    Jin, Z. J.
    Yuan, Z. W.
    Li, Q.
    Wang, K.
    ADVANCES IN ABRASIVE TECHNOLOGY XIV, 2011, 325 : 464 - 469
  • [37] Passivation and Polishing Behavior of Chitosan in Low Pressure Chemical Mechanical Polishing of Aluminum
    Ren R.
    Sun P.
    Wang Y.
    Ding Z.
    Zhao D.
    Yu Z.
    Cailiao Daobao/Materials Reports, 2023, 37 (16):
  • [38] Chemically enhanced synergistic wear: A copper chemical mechanical polishing case study
    Nolan, Lucy M.
    Cadien, Kenneth C.
    WEAR, 2013, 307 (1-2) : 155 - 163
  • [39] Chemical-mechanical polishing of copper with model slurries
    Lee, BC
    Duquette, DJ
    Gutmann, RJ
    ELECTROCHEMICAL SCIENCE AND TECHNOLOGY OF COPPER, PROCEEDINGS, 2002, 2000 (30): : 103 - 116
  • [40] Lubricating behavior in chemical-mechanical polishing of copper
    Liang, H
    Xu, GH
    SCRIPTA MATERIALIA, 2002, 46 (05) : 343 - 347