BALL FORMATION IN ALUMINUM BALL BONDING.

被引：0
|
作者：
Onuki, Jin [1 ]
Suwa, Masateru [1 ]
Iizuka, Tomio [1 ]
Okikawa, Susumu [1 ]
机构：
[1] Hitachi Ltd, Jpn, Hitachi Ltd, Jpn
来源：
| 1600年 / CHMT-8期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
ALUMINUM AND ALLOYS
引用
收藏
相关论文
共 50 条
  • [41] Ball,Ball!
    乐乐姐姐
    小cool龙
    课堂内外(小学版), 2018, (Z1) : 98 - 101
  • [42] ADHESIVE BONDING.
    Lilholt, H.
    Lystrup, Aa.
    Toftegaard, H.
    Riso National Laboratory (Report) Riso-M (Denmark), 1983,
  • [43] FUSION BONDING.
    Wragg, R.T.
    Yardley, J.F.
    Nightingale, A.F.
    Kautschuk und Gummi, Kunststoffe, 1981, 34 (08): : 657 - 660
  • [44] Vibration Bonding.
    Ruhsland, Klaus
    Schweisstechnik Berlin, 1979, 29 (11): : 508 - 511
  • [45] Effect of formation, ball in play and ball possession on peak demands in elite soccer
    Riboli, Andrea
    Semeria, Marco
    Coratella, Giuseppe
    Esposito, Fabio
    BIOLOGY OF SPORT, 2021, 38 (02) : 195 - 205
  • [46] BALL MILLING-INDUCED NANOCRYSTAL FORMATION IN ALUMINUM-BASED METALLIC GLASSES
    HE, Y
    SHIFLET, GJ
    POON, SJ
    ACTA METALLURGICA ET MATERIALIA, 1995, 43 (01): : 83 - 91
  • [47] Effect of Ball Size and Ball to Powder Ratio Variation on Crystallite Size and Formation of Nanocrystalline Materials in Planetary Ball Mill
    Salili, S. M.
    Ataie, A.
    Sadighi, Z.
    INTERNATIONAL CONGRESS ON ADVANCES IN APPLIED PHYSICS AND MATERIALS SCIENCE, 2011, 1400 : 127 - 130
  • [48] Study on the Riveting Forming of Aluminum Ball Joint
    Tian, H. B.
    Liu, X. H.
    Li, X. L.
    Yuan, W. J.
    Feng, J.
    3RD INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING AND AUTOMATION SCIENCE (ICMEAS 2017), 2017, 280
  • [49] Optimal Gold-Ball Bonding Parameters Determined from Ball Shear and Wire Pull Tests
    Tsai, M. Y.
    Liu, R. G.
    FRONTIERS OF GREEN BUILDING, MATERIALS AND CIVIL ENGINEERING, PTS 1-8, 2011, 71-78 : 1761 - 1764
  • [50] Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
    Gan, Chong Leong
    Classe, Francis
    Hashim, Uda
    MICROELECTRONICS INTERNATIONAL, 2013, 30 (03) : 169 - 175
12345