Role of intermetallic compounds in lead-free soldering

被引：0
|
作者：
Harris, Paul G. [1 ]
Chaggar, Kaldev S. [1 ]
机构：
[1] ITRI Ltd, Middlesex, United Kingdom
来源：
Soldering and Surface Mount Technology | 1998年 / 30期
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学科分类号：
摘要：
32
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页码：38 / 52
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