PRINTED CIRCUIT MULTILAYER PROCESSES AND MATERIALS REVIEW.

被引：0

作者：

Dominici, Peter A. ^{[1
]}

Kinsey, Steve ^{[1
]}

机构：

[1] Electrotek, Oak Creek, WI, USA, Electrotek, Oak Creek, WI, USA

来源：

Electron Manuf | 1988年 / 34卷 / 05期

关键词：

LAMINATED PRODUCTS;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Multilayer circuits consist of layers of circuitry that are carefully registered and then laminated (pressed) together. Interconnections to the various circuitry layers are made through plated through holes. This paper gives an explanation of the construction of multilayer boards. The various stages of production and construction materials necessary are described.

引用

页码：14 / 16

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