Grain boundary mobility during recrystallization of copper

被引：0
|
作者：
Naval Research Lab, Washington, United States [1 ]
机构：
来源：
Metall Mat Trans A Phys Metall Mat Sci | / 3 A卷 / 749-754期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Dimensions of grain boundary mobility
    Manohar, PA
    Chandra, T
    ISIJ INTERNATIONAL, 1997, 37 (07) : 726 - 728
  • [42] GRAIN BOUNDARY MOBILITY IN BISMUTH
    FRASER, MJ
    GOLD, RE
    MULLINS, WW
    ACTA METALLURGICA, 1961, 9 (10): : 960 - 961
  • [43] The grain boundary mobility tensor
    Chen, Kongtao
    Han, Jian
    Pan, Xiaoqing
    Srolovitz, David J.
    PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2020, 117 (09) : 4533 - 4538
  • [44] RECRYSTALLIZATION AND GRAIN BOUNDARY SLIDING IN A MAGNESIUM ALLOY
    HARRIS, JE
    NATURE, 1963, 200 (491) : 1197 - &
  • [45] Transformations in the Grain Boundary Ensemble of M1 Copper Subjected to Equal-Channel Angular Pressing during Recrystallization Annealing
    Perevalova O.B.
    Konovalova E.V.
    Kolobov Y.R.
    Korshunov A.I.
    Perevalova, O.B. (perevalova52@mail.ru), 2018, Pleiades journals (82) : 773 - 777
  • [46] INFLUENCE OF STRONG GRAIN-BOUNDARY PINNING BY PARTICLES UPON GRAIN-BOUNDARY STRUCTURE DURING POST-RECRYSTALLIZATION ANNEALS
    RANDLE, V
    RALPH, B
    JOURNAL OF MATERIALS SCIENCE, 1987, 22 (07) : 2535 - 2541
  • [47] ON THE GRAIN-BOUNDARY PARTICLE PINNING DURING RECRYSTALLIZATION OF A1-LI ALLOYS
    GONCALVES, M
    SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (04): : 835 - 840
  • [48] On the grain boundary character distribution of Incoloy 800H during dynamic recrystallization
    Cao, Yu
    Di, Hongshuang
    Huang, Guangjie
    JOURNAL OF NUCLEAR MATERIALS, 2017, 486 : 21 - 25
  • [49] A phase-field simulation study of irregular grain boundary migration during recrystallization
    Moelans, N.
    Zhang, Y. B.
    Godfrey, A.
    Jensen, D. Juul
    36TH RISO INTERNATIONAL SYMPOSIUM ON MATERIALS SCIENCE, 2015, 89
  • [50] Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper
    Lee, Ho Won
    Im, Yong-Taek
    MATERIALS TRANSACTIONS, 2010, 51 (09) : 1614 - 1620
12345