Effect of multi-step wafer annealing on the characteristic of undoped LEC SI-GaAs

被引:0
|
作者
机构
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] A study of annealing behavior of EL2 and EL6 groups in SI-GaAs
    Wu, FM
    Zhao, ZY
    COMPOUND SEMICONDUCTOR ELECTRONICS AND PHOTONICS, 1996, 421 : 269 - 274
  • [42] Enhanced perovskite phototransistor by multi-step slow annealing strategy
    Cao, Mingxuan
    Zhang, Yating
    Yu, Yu
    Jin, Lufan
    Li, Yifan
    Chen, Zhiliang
    Che, Yongli
    Dai, Haitao
    Zhang, Guizhong
    Yao, Jianquan
    OPTICAL MATERIALS, 2018, 84 : 498 - 503
  • [43] Two and multi-step annealing of cereal starches in relation to gelatinization
    Shi, Yong-Cheng
    JOURNAL OF AGRICULTURAL AND FOOD CHEMISTRY, 2008, 56 (03) : 1097 - 1104
  • [44] PHOTOCONDUCTIVITY AND PHOTOMAGNETOELECTRIC EFFECT OF SI-GAAS IN THE PRESENCE OF DIFFERENT SURFACE RECOMBINATION REGIMES
    GIRARD, P
    SICART, J
    PISTOULET, B
    SOLID-STATE ELECTRONICS, 1984, 27 (02) : 195 - 201
  • [45] 大直径LEC Si-GaAs中深施主缺陷的红外光谱分析
    孙卫忠
    王娜
    王丽华
    郝秋艳
    刘彩池
    现代仪器, 2009, 15 (05) : 41 - 42+50
  • [46] Selectively enhanced oxygen vacancies in undoped polycrystalline ZnO as a consequence of Multi-Step Sintering
    Kondal, Neha
    Tiwari, Sanjiv Kumar
    CERAMICS INTERNATIONAL, 2017, 43 (13) : 10347 - 10352
  • [47] Two- and multi-step annealing of cereal starches in relation to gelatinization
    Shi, Yong-Cheng
    Journal of Agricultural and Food Chemistry, 2008, 56 (03): : 1097 - 1104
  • [48] Generation and motion of dislocations in silicon wafers subjected to multi-step annealing
    Mezhennyi, MV
    Mil'vidskii, MG
    Reznik, VY
    Falster, RJ
    JOURNAL OF PHYSICS-CONDENSED MATTER, 2002, 14 (48) : 12909 - 12915
  • [49] Improved perovskite phototransistor prepared using multi-step annealing method
    Cao, Mingxuan
    Zhang, Yating
    Yu, Yu
    Yao, Jianquan
    ORGANIC PHOTONIC MATERIALS AND DEVICES XX, 2018, 10529
  • [50] A Multi-step Approach for Identifying Unknown Defect Patterns on Wafer Bin Map
    Shin, Jin-Su
    Lee, Dong-Hee
    INDUSTRIAL ENGINEERING AND APPLICATIONS-EUROPE, ICIEA-EU 2024, 2024, 507 : 213 - 226