Thermal enhancement coatings for microelectronic systems

被引：0
|
作者：
Fletcher, L.S. [1 ]
Lambert, M.A. [1 ]
Marotta, E.E. [1 ]
机构：
[1] Texas A&M Univ, College Station, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1998年 / 120卷 / 03期
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页码：229 / 236
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