AMMONIA TREATMENT OF LARGE AND SMALL HAY PACKAGES.

被引：0
|
作者：
Koegel, R.G. [1 ]
Straub, R.J. [1 ]
Shinners, K.J. [1 ]
机构：
[1] US Dairy Forage Research Cent, USA, US Dairy Forage Research Cent, USA
来源：
Transactions of the American Society of Agricultural Engineers | 1985年 / 28卷 / 03期
关键词：
HAY PACKAGES;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：726 / 730
相关论文
共 50 条
  • [41] HOW AND WHY TO MARK ELECTRONIC COMPONENTS, BOARDS, AND PACKAGES.
    Nelson, Benjamin A.
    Electron Manuf, 1988, 34 (06): : 8 - 9
  • [42] INTERACTIVE USER-FRIENDLY INTERFACES TO STATISTICAL PACKAGES.
    Smith, A.M.R.
    Lee, L.S.
    Hand, D.J.
    1600, (26):
  • [43] TWO TO TANGO: PAIRING THE SPSS AND SAS STATISTICAL PACKAGES.
    Roberts, Justine
    Software Review, 1982, 1 (01): : 35 - 43
  • [44] HELIUM LEAK DETECTION IN VACUUM SYSTEMS AND IC PACKAGES.
    Singer, Peter H.
    Semiconductor International, 1987, 10 (11) : 51 - 55
  • [45] SHELF LIFE OF FRUIT JUICES IN OXYGEN PERMEABLE PACKAGES.
    Bourque, Raymond A.
    1600, (01):
  • [46] TRIPLE SCHMIDT TRIGGER FORMED FROM TWO PACKAGES.
    Wilson, Keith
    Electronic Engineering (London), 1977, 49 (597):
  • [47] Comparing the results of two CCD image reduction packages.
    Kgoadi, R.
    Engelbrecht, C. A.
    PROCEEDINGS OF SAIP2014: THE 59TH ANNUAL CONFERENCE OF THE SOUTH AFRICAN INSTITUTE OF PHYSICS, 2014, : 336 - 340
  • [48] Accuracy and pourability of gypsum pre-weight packages.
    Wee, AG
    Johnson, WM
    Monaghan, P
    Clay, NJ
    JOURNAL OF DENTAL RESEARCH, 2000, 79 : 531 - 531
  • [49] ADHESIVE RELATED FAILURE MECHANISMS IN MILITARY HYBRID PACKAGES.
    Bolger, Justin C.
    International Journal of Microcircuits and Electronic Packaging, 1984, 7 (04): : 23 - 28
  • [50] METHOD OF PROGRAM GENERATION IN CURRENT ES PROGRAM PACKAGES.
    Mikhailyuk, V.A.
    Programming and Computer Software (English Translation of Programmirovanie), 1979, 5 (06): : 396 - 400
12345