Plastic packaging modeling and characterization at RF/microwave frequencies

被引：0
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作者：
Riad, Sedki M. [1 ]
Su, Wansheng [1 ]
Salama, Iman [1 ]
Elshabini-Riad, Aicha [1 ]
Rachlin, Michael [1 ]
Baker, Walter [1 ]
Perdue, James [1 ]
机构：
[1] Virginia Polytechnic Inst &, State Univ, Blacksburg, United States
来源：
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | 1997年
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