Characterization of 2 inch SiC wafers made by the sublimation method

被引:0
|
作者
Sasaki, M. [1 ]
Shiomi, H. [1 ]
Nishino, S. [1 ]
机构
[1] Faculty of Engineering and Design, Kyoto Institute of Technology, Matsugasaki, Sakyo, Kyoto 606-8585, Japan
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D O I
10.4028/www.scientific.net/msf.353-356.267
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6
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页码:267 / 270
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