DEVELOPMENT OF A HIGH THERMAL CONDUCTIVE AlN CERAMIC SUBSTRATE TECHNOLOGY.

被引：0

作者：

Iwase, Nobuo ^{[1
]}

Tsuge, Akihiko ^{[1
]}

Sugiura, Yasuyuki ^{[1
]}

机构：

[1] Toshiba R&D Cent, Kawasaki, Jpn, Toshiba R&D Cent, Kawasaki, Jpn

来源：

International Journal of Microcircuits and Electronic Packaging | 1984年 / 7卷 / 04期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUIT MANUFACTURE

引用

页码：49 / 53

共 50 条

[41] DEVELOPMENT OF FIBER LIGHTGUIDE TECHNOLOGY.
Sood, R.K.
Prasad, C.R.
Singh, Nahar
CSIO Communications (Central Scientific Instruments Organization), 1986, 13 (1-2): : 24 - 29
[42] Development of coating resin technology.
Webster, DC
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2002, 223 : D43 - D43
[43] MINERAL RESOURCES, DEVELOPMENT AND TECHNOLOGY.
Cohen, H.E.
1600, (86):
[44] Ceramic interconnection substrate technology
Cote, Rene
Paxson, John
London, Andy
Barlow, Fred
Sigliano, Rick
Horowitz, Sam
Wolf, Chris
National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 1999, 2 : 889 - 912
[45] HIGH ALLOY CASTING TECHNOLOGY.
George, Glenn W.
Spence, Thomas C.
World Pumps, 1982, (12) : 547 - 549
[46] Advances in kinetic thermal cycling technology.
Watson, R
Higuchi, R
Larid, W
Saiki, R
CLINICAL CHEMISTRY, 1997, 43 (11) : 41 - 41
[47] Thermal conductivity of single crystal and ceramic AlN
AlShaikhi, A.
Srivastava, G. P.
JOURNAL OF APPLIED PHYSICS, 2008, 103 (08)
[48] Thermal conductivity of single crystal and ceramic AlN
Alshaikhi, A.
Srivastava, G.P.
Journal of Applied Physics, 2008, 103 (08):
[49] Ceramic interconnect technology. Meeting wireless/RF needs
Horowitz, Samuel J.
Amey, Daniel I.
Draudt, Rick R.
Printed Circuit Fabrication, 1998, 21 (06): : 34 - 36
[50] Parliaments and technology. The development of technology assessment in Europe
Cope, D
MINERVA, 2002, 40 (04) : 421 - 424