Structural characterization of rapid thermal oxidized Si1-x-yGexCy alloy films grown by rapid thermal chemical vapor deposition

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作者
Choi, W.K.
Chen, J.H.
Bera, L.K.
Feng, W.
Pey, K.L.
Mi, J.
Yang, C.Y.
Ramam, A.
Chua, S.J.
Pan, J.S.
Wee, A.T.S.
Liu, R.
机构
[1] Microelectronics Laboratory, Department of Electrical Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore
[2] Microelectronics Laboratory, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053, United States
[3] IMRE, NUS, Blk S7, Singapore 119260, Singapore
[4] Surface Science Laboratory, Department of Physics, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore
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| 1600年 / American Institute of Physics Inc.卷 / 87期
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摘要
The structural properties of as-grown and rapid thermal oxidized Si1-x-yGexCy epitaxial layers have been examined using a combination of infrared, x-ray photoelectron, x-ray diffraction, secondary ion mass spectroscopy, and Raman spectroscopy techniques. Carbon incorporation into the Si1-x-yGexCy system can lead to compressive or tensile strain in the film. The structural properties of the oxidized Si1-x-yGexCy film depend on the type of strain (i.e., carbon concentration) of the as-prepared film. For compressive or fully compensated films, the oxidation process drastically reduces the carbon content so that the oxidized films closely resemble to Si1-xGex films. For tensile films, two broad regions, one with carbon content higher and the other lower than that required for full strain compensation, coexist in the oxidized films. © 2000 American Institute of Physics.
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