Use of multi-chip modules in safety critical systems

被引：0
|
作者：
Roughton, Mike
Hinde, Gary
机构：
来源：
Electronic Engineering (London) | 1994年 / 66卷 / 809期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Modelling and Design of High Performance Capacitors for CPW Multi-Chip Modules
    Samanta, K. K.
    Robertson, I. D.
    2011 41ST EUROPEAN MICROWAVE CONFERENCE, 2011, : 301 - 304
  • [32] Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules
    Najmi Jarwala
    Journal of Electronic Testing, 1997, 10 : 77 - 86
  • [33] Application of AOI light source modes in multi-chip modules inspection
    Wu, Yilong
    Wen, Junling
    Zhang, Pingsheng
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 141 - 143
  • [34] Short-circuit Performance of Multi-chip SiC MOSFET Modules
    Kadavelugu, Arun
    Aeloiza, Eddy
    Belcastro, Christopher
    2017 IEEE 5TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2017, : 285 - 290
  • [35] Reliability testing of high-power multi-chip IGBT modules
    Lefranc, G
    Licht, T
    Schultz, HJ
    Beinert, R
    Mitic, G
    MICROELECTRONICS RELIABILITY, 2000, 40 (8-10) : 1659 - 1663
  • [36] Optoelectronic multi-chip modules based on imaging fiber bundle structures
    Chiarulli, DM
    Levitan, SP
    Robinson, M
    Tatah, K
    LEOS 2000 - IEEE ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS. 1 & 2, 2000, : 423 - 423
  • [37] Natural convection from a horizontal disk of simulated multi-chip modules
    Hung, YH
    Shieh, YR
    Li, CJ
    HEAT TRANSFER 1998, VOL 3: GENERAL PAPERS, 1998, : 355 - 360
  • [38] Designing ''dual personality'' IEEE 1149.1 compliant multi-chip modules
    Jarwala, N
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 1997, 10 (1-2): : 77 - 86
  • [39] Designing `dual personality' IEEE 1149.1 compliant multi-chip modules
    Engineering Research Cent, Princeton, United States
    J Electron Test Theory Appl JETTA, 1-2 (77-86):
  • [40] VHDL-AMS Modelling of Multi-chip SiC Power Modules
    Olanrewaju, Olufisayo
    Mouawad, Bassem
    Castellazzi, Alberto
    Kraus, Rainer
    2016 IEEE 4TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2016, : 347 - 352
12345