Use of multi-chip modules in safety critical systems

被引：0
|
作者：
Roughton, Mike
Hinde, Gary
机构：
来源：
Electronic Engineering (London) | 1994年 / 66卷 / 809期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Preparation and use of chip capacitors in ultra-dense multi-chip modules
    Pryputniewicz, D
    Kondoleon, C
    Haley, J
    Marinis, T
    MATERIALS, INTEGRATION AND PACKAGING ISSUES FOR HIGH-FREQUENCY DEVICES, 2004, 783 : 197 - 202
  • [2] SILICON HYBRID MULTI-CHIP MODULES
    TRIGG, AD
    ELECTRONIC PACKAGING MATERIALS SCIENCE IV, 1989, 154 : 53 - 62
  • [3] Multi-chip modules testing and DFT
    Zorian, Y
    Marzouki, M
    38TH MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, PROCEEDINGS, VOLS 1 AND 2, 1996, : 722 - 725
  • [4] Multi-chip modules innovating packaging solutions
    MicroModule Systems, Inc
    IC Card Syst Des, 2 (4pp):
  • [5] Clock tree synthesis for multi-chip modules
    Lehther, D
    Sapatnekar, SS
    1996 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN - DIGEST OF TECHNICAL PAPERS, 1996, : 50 - 53
  • [6] Chip mounting and interconnection in multi-chip modules for space applications
    Nilsson, P
    Jönsson, M
    Stenmark, L
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2001, 11 (04) : 339 - 343
  • [7] Designing self-testable multi-chip modules
    Zorian, Y
    Bederr, H
    EUROPEAN DESIGN & TEST CONFERENCE 1996 - ED&TC 96, PROCEEDINGS, 1996, : 181 - 185
  • [8] Structural Strength and Temperature Condition of Multi-Chip Modules
    Pogalov A.I.
    Blinov G.A.
    Chugunov E.Y.
    Chugunov, E. Yu. (Chugunov-EU@inbox.ru), 2018, Pleiades journals (47) : 460 - 464
  • [9] Behavioral Modeling for Stability in Multi-Chip Power Modules
    Mazzola, Michael
    Rahmani, Maryam
    Gafford, James
    Lemmon, Andrew
    Graves, Ryan
    2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 87 - 90
  • [10] Development of SFQ multi-chip modules for quantum bits
    Miyazaki, Toshiyuki
    Yorozu, Shinichi
    Maezawa, Masaaki
    Hidaka, Mutsuo
    Tsai, Jaw-Shen
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2007, 17 (02) : 158 - 161
12345