Step-by-step SMT: Test and inspection

被引：0

作者：

Oresjo, Stig ^{[1
]}

机构：

[1] Hewlett-Packard, Loveland, United States

来源：

Surface mount technology | 1996年 / 10卷 / 10期

关键词：

Automatic optical inspection (AOI) - Flying probe tester - In circuit testers (ICT) - Manufacturing defect analyzer (MDA) - Solder paste inspection;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The test and inspection of printed circuit boards (PCB) must be carefully optimized at various points in the assembly process to minimize the manufacturing cost. Each level of test and inspection already covers a significant portion of the assembly fault and process control. Treating each step as part of the overall process will reduce redundant coverage and result in cost savings.

引用

共 50 条

[1] Step-by-step: SMT: Test and inspection
Arena, J. (john.arena@teradyne.com), 2001, Surface Mount Technology Association (15):
[2] Step-by-step SMT
Löw, Norbert
Muehlbauer, Andreas
SMT Surface Mount Technology Magazine, 2001, 15 (09):
[3] Step-by-step SMT: Soldering
Zarrow, Phil
Surface mount technology, 2000, 14 (08):
[4] Step-by-step: SMT Step 4 - Printing
Prasad, Ray P.
SMT Surface Mount Technology Magazine, 2001, 15 (04): : 88 - 91
[5] Step-by-step SMT: Component placement
Prasad, Ray
Surface mount technology, 1995, 9 (06):
[6] Step-by-step smt step 2 - Process control
Rowland, Robert
Woody, Tom
SMT Surface Mount Technology Magazine, 2001, 15 (02):
[7] Step-by-step: SMT 101 step 7 - Soldering
Gilbert, Bob
SMT Surface Mount Technology Magazine, 2002, 15 (08): : 50 - 58
[8] Step-by-step SMT Step 6 - Component placement
Wischoffer, Scott
SMT Surface Mount Technology Magazine, 2001, 15 (06): : 75 - 76
[9] Step-by-step SMT: Adhesives, epoxies and dispensing
Burns, Barry
Fisher, Edward
Hoffman, Bob
SMT Surface Mount Technology Magazine, 2001, 15 (05): : 74 - 79
[10] Step-by-step: Smt 101 step 3 - Solder materials
Hwang, Jennie S.
SMT Surface Mount Technology Magazine, 2001, 15 (03):

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