Step-by-step SMT Step 6 - Component placement

被引：0

作者：

Wischoffer, Scott ^{[1
]}

机构：

[1] Fuji America Corp., 171 Corporate Woods Pkwy., Vernon Hills, IL 60061, United States

来源：

SMT Surface Mount Technology Magazine | 2001年 / 15卷 / 06期

关键词：

Computer aided engineering - Electronics packaging - Printed circuit boards - Process engineering - Production engineering - Quality function deployment - Vacuum applications;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The pick-and-place concept is the process of taking the components used to build a product from the reel, stick or tray and placing them in the correct place on the board in the correct direction. This paper introduces this process and provides some practical guidelines about approaching the assessment of pick-and-place equipment.

引用

页码：75 / 76

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