Layout design on bond pads to improve the firmness of bond wire in packaged IC products

被引：0
|
作者：
Peng, Jeng-Jie [1 ]
Ker, Ming-Dou [1 ]
Wang, Nien-Ming [1 ]
Jiang, Hsin-Chin [1 ]
机构：
[1] Industrial Technology Research Inst, (ITRI), Hsinchu, Taiwan
来源：
International Symposium on VLSI Technology, Systems, and Applications, Proceedings | 1999年
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摘要：
14
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页码：147 / 150
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