HIGH VOLTAGE, HIGH CURRENT, NON-DESTRUCTIVE FBSOA TESTING. PART I.

被引:0
|
作者
Pshaenich, Al [1 ]
机构
[1] Motorola Inc, Phoenix, AZ, USA, Motorola Inc, Phoenix, AZ, USA
来源
| 1984年 / 10期
关键词
D O I
暂无
中图分类号
TN [电子技术、通信技术];
学科分类号
0809 ;
摘要
The non-destruct testing of Forward Bias Safe Operating Area (FBSOA) is considered. Since conventional methods of measuring the Second Breakdown (S. B. ) limits of the FBSOA curve invariably results in device failure, the generation of a complete family of curves through destructive testing is costly and time consuming. Generally, the transistor under test (TUT) is measured for S. B. capability in a common base configuration, allowing for easily adjustable and repeatable collector current, collector-emitter voltage and pulse width measurements. Non-destructive FBSOA testers are discussed and the methods and test circuitry used in Motorola test fixtures are described.
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