Packaging techniques for modern microelectronics equipment

被引：0
|
作者：
ROBERTSON FA
机构：
来源：
Electronics and Power | 1971年 / 17卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This article explains packaging problems in the past, and presents a pattern of design for the future.
引用
收藏
页码：406 / 409
相关论文
共 50 条
  • [41] EMC techniques in a high-density packaging system for telecommunication equipment
    Mori, T
    Shinozaki, K
    Yanagiya, M
    NTT REVIEW, 1997, 9 (06): : 39 - 43
  • [42] Packaging equipment
    1600, (36):
  • [43] Equipment for packaging
    Baryshev, I.N.
    Egorov, I.A.
    Khimicheskoe I Neftegazovoe Mashinostroenie, 1996, (05): : 19 - 22
  • [44] Packaging equipment
    Snyder, MR
    MODERN PLASTICS, 1996, 73 (07): : 81 - 81
  • [45] Modern microelectronics and microfluidics on microneedles
    Han, Yanzhang
    Li, Jun
    Chen, Tingting
    Gao, Bingbing
    Wang, Huili
    ANALYST, 2023, 148 (19) : 4591 - 4615
  • [46] MODERN STATE AND PERSPECTIVES OF INDUSTRY EQUIPMENT DEVELOPMENT FOR CYTOCHEMICAL TECHNIQUES
    ZARUBINA, IL
    DAVYDOVA, MI
    KULAKOV, AA
    SMIRNOV, VA
    TSITOLOGIYA, 1976, 18 (04): : 521 - 528
  • [47] ELECTRONIC PACKAGING AND CORROSION - FORECAST - CORROSION IN MICROELECTRONICS
    FRANKENTHAL, RP
    MICROPROCESSING AND MICROPROGRAMMING, 1987, 19 (05): : 427 - 427
  • [48] Study of a laser microwelding process for microelectronics and packaging
    Han, W
    Pryputniewicz, RJ
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 713 - 716
  • [49] Future direction and challenges for microelectronics packaging materials
    Wakharkar, Vijay
    Matayabas, J. C., Jr.
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 1875 - 1880
  • [50] On-line microelectronics and packaging industries guide
    不详
    MRS BULLETIN, 2001, 26 (08) : 607 - 607
12345