MINIATURIZATION AND HIGH SENSITIVITY ARE KEY WORDS FOR PC BOARD RELAYS.

被引：0
|
作者：
Mitsuishi, Shoji [1 ]
机构：
[1] Takamisawa Electric Co, Jpn, Takamisawa Electric Co, Jpn
来源：
JEE. Journal of electronic engineering | 1985年 / 22卷 / 227期
关键词：
MINIATURIZATION - PC BOARD RELAYS - SURFACE MOUNTING;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：70 / 73
相关论文
共 50 条
  • [31] Embedded PC is key part of high-contrast projector range
    不详
    AIRCRAFT ENGINEERING AND AEROSPACE TECHNOLOGY, 2007, 79 (06): : 695 - 695
  • [32] KEY-OPERATED SWITCHES FOR PC BOARD INSTALLATION WITH 15 kV FLASH-OVER STRENGTH.
    Liebich, Ernst
    Siemens Components, 1985, 20 (05): : 189 - 191
  • [33] Photonic Crystal (PC) Waveguide Based Optical Filters for Dense Integration of High Sensitivity PC Biosensors
    Yan, Hai
    Zou, Yi
    Yang, Chun-Ju
    Wang, Zheng
    Tang, Naimei
    Chakravarty, Swapnajit
    Chen, Ray T.
    2014 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2014,
  • [34] Development of a High-sensitivity Accelerometer Board for Structural Health Monitoring
    Jo, Hongki
    Rice, Jennifer A.
    Spencer, B. F., Jr.
    Nagayama, Tomonori
    SENSORS AND SMART STRUCTURES TECHNOLOGIES FOR CIVIL, MECHANICAL, AND AEROSPACE SYSTEMS 2010, 2010, 7647
  • [35] DIP SWITCHES SATISFY HIGH-DENSITY PC-BOARD DESIGN NEEDS
    ORMOND, T
    EDN, 1989, 34 (26) : 44 - &
  • [36] HIGH-DENSITY CONNECTORS SOLVE TOUGH PC-BOARD INTERCONNECT PROBLEMS
    ORMOND, T
    EDN, 1991, 36 (14) : 64 - &
  • [37] A FAST, HIGH-PRECISION AND INEXPENSIVE ANALOG TO DIGITAL BOARD FOR PC-AT OR COMPATIBLE
    MANIS, PB
    BERTRAND, D
    JOURNAL OF NEUROSCIENCE METHODS, 1989, 30 (01) : 41 - 54
  • [38] SUPERCONDUCTING SYSTEM FOR HIGH SENSITIVITY MEASUREMENTS OF PC 1 GEOMAGNETIC PULSATIONS
    BUXTON, JL
    FRASERSM.AC
    IEEE TRANSACTIONS ON GEOSCIENCE AND REMOTE SENSING, 1974, GE12 (04): : 109 - 113
  • [39] Tough high-heat thermoplastics: Key to circuit-board downsizing
    Wilder, Robert V.
    Modern Plastics, 1988, 65 (13): : 60 - 61
  • [40] Study of Key Failure Modes of PTH in High Density Printed Board and Case Study
    Yao Bin
    Chen Hui
    Lu Yudong
    Luo Daojun
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 923 - 927
12345