Silicon-on-insulator wafer bonding-wafer thinning technological evaluations

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[1] Haisma, J.
[2] Spierings, G.A.C.M.
[3] Biermann, U.K.P.
[4] Pals, J.A.
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Haisma, J. | 1600年 / 28期
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Integrated Circuit Manufacture;
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