NEW DEVELOPMENTS IN AUTOMATIC WIRE BONDING EQUIPMENT.

被引：0

作者：

Beyerlein, Fritz W.

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来源：

Electronic Packaging and Production | 1978年 / 18卷 / 01期

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摘要：

Volume-production proven bonders are now microprocessor controlled, offer self-teach programming and bond 7,000 to 10,000 wires/hour. Automatic pattern recognition alignment, electronic Z-motion control and bonding rates of 12,000 wires/hour are emerging.

引用

页码：54 / 64

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