NEW DEVELOPMENTS IN AUTOMATIC WIRE BONDING EQUIPMENT.

被引：0

作者：

Beyerlein, Fritz W.

机构：

来源：

Electronic Packaging and Production | 1978年 / 18卷 / 01期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Volume-production proven bonders are now microprocessor controlled, offer self-teach programming and bond 7,000 to 10,000 wires/hour. Automatic pattern recognition alignment, electronic Z-motion control and bonding rates of 12,000 wires/hour are emerging.

引用

页码：54 / 64

共 50 条

[1] Gearless Wire Feed - A New Possibility in the Design of Automatic Welding Equipment.
Thor, Kurt
Schweisstechnik (Berlin), 1976, 26 (06): : 262 - 265
[2] NEW BONDING WIRE DEVELOPMENTS
DOUGLAS, P
MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 3 - 6
[3] AUTOMATIC INSPECTION EQUIPMENT.
Quinn, R.M.
1600, (18):
[4] WIRE PROCESSING AND TERMINATING EQUIPMENT.
Erickson, Dallas
Electronic Packaging and Production, 1979, 19 (10):
[5] DEVELOPMENTS IN PCB CLEANING EQUIPMENT.
Walton, J.Page
EP Electronic Production (London), 1985, 14 (06): : 16 - 17
[6] NEW DEVELOPMENTS IN THIN WALL ZINC DIE CASTING EQUIPMENT.
Randolph, Jack
Hayner, P.F.
Thompson, T.W.
Reichard, D.
Die Casting Engineer, 1977, 21 (04): : 16 - 26
[7] DEVELOPMENTS IN PCB COMPONENT INSERTION EQUIPMENT.
Walton, J.Page
EP Electronic Production (London), 1986, 15 (01):
[8] MAXIMIZE THE THROUGHPUT OF AUTOMATIC INSERTION EQUIPMENT.
Cooper, S.A.
Electronic Packaging and Production, 1986, 26 (08): : 69 - 71
[9] New developments in road maintenance equipment. Chip seals and current maintenance
Behr, M.
Baroux, R.
Transportation Research Record, 1988, (1183) : 59 - 67
[10] AUTOMATIC VS MANUAL TEST EQUIPMENT.
Sigsby, Bob
Computer Design, 1975, 14 (02): : 92 - 94

← 1 2 3 4 5 →