EFFECTS OF INTEGRATED CIRCUITS ON USAGE TRENDS FOR PRINTED CIRCUIT BOARDS.

被引：0

作者：

Dicken, Howard K.

机构：

来源：

Insulation, circuits | 1980年 / 26卷 / 09期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The trend to eliminate the long-term need for printed circuit boards is considered in the light of the advent of VLSI and more electronics being placed on a single chip of silicon. The article discusses some examples, technical trends, and forcing factors which will determine printed circuit board requirements for the next several years.

引用

页码：37 / 39

共 50 条

[21] TESTING OF UNPOPULATED SMD PRINTED CIRCUIT BOARDS.
Prokopp, M.
Circuit World, 1987, 13 (04) : 42 - 43
[22] Technological Problems and Their Solution for Printed Circuit Boards.
Bogenschuetz, August F.
Jostan, Josef L.
Wissenschaftliche Berichte AEG-Telefunken, 1979, 52 (1-2): : 64 - 71
[23] New Technologies in the Manufacture of Printed Circuit Boards.
Michalski, Jerzy
Elektronika Warszawa, 1981, 22 (11-12): : 27 - 29
[24] PLUGGABLE INTERFACE PACKAGING FOR PRINTED CIRCUIT BOARDS.
Uberbacher, E.C.
IBM technical disclosure bulletin, 1983, 25 (12): : 6717 - 6718
[25] HIGH SPEED DIGITAL PRINTED CIRCUIT BOARDS.
Keeler, Robert
Electronic Packaging and Production, 1986, 26 (01): : 140 - 145
[26] New Fabrication Facilities for Printed-Circuit Boards.
Augsburg, Gunter
Hoffman, Manfred
Wuensche, Hatto
Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224
[27] COMPUTER SYSTEM ACCELERATES DESIGN OF PRINTED CIRCUIT BOARDS.
Allum, Bob
Paterson, John
Shastry, Balakrishna
1600, (04):
[28] REMOVING SOLDER BRIDGES FROM PRINTED CIRCUIT BOARDS.
Comerford, M.F.
Insulation, circuits, 1981, 27 (04): : 31 - 34
[29] New Method of Computer Layout of Printed Circuit Boards.
Schenke, W.
Elektronik Produktion & Prueftechnik, 1981, (09): : 478 - 479
[30] HOW TO SELECT A CONFORMAL COATING FOR PRINTED CIRCUIT BOARDS.
Waryold, John
Insulation/Circuits, 1974, 20 (07): : 29 - 31

← 1 2 3 4 5 →