共 50 条
- [21] New Technologies in the Manufacture of Printed Circuit Boards. Elektronika Warszawa, 1981, 22 (11-12): : 27 - 29
- [22] PLUGGABLE INTERFACE PACKAGING FOR PRINTED CIRCUIT BOARDS. IBM technical disclosure bulletin, 1983, 25 (12): : 6717 - 6718
- [23] HIGH SPEED DIGITAL PRINTED CIRCUIT BOARDS. Electronic Packaging and Production, 1986, 26 (01): : 140 - 145
- [24] New Fabrication Facilities for Printed-Circuit Boards. Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224
- [26] REMOVING SOLDER BRIDGES FROM PRINTED CIRCUIT BOARDS. Insulation, circuits, 1981, 27 (04): : 31 - 34
- [27] New Method of Computer Layout of Printed Circuit Boards. Elektronik Produktion & Prueftechnik, 1981, (09): : 478 - 479
- [28] Currentless Copper Plating of Multilayer Printed Circuit Boards. Elektronikpraxis, 1980, 15 (12): : 76 - 79
- [30] POWER SUPPLY CONSTRUCTION FOR USE ON PRINTED CIRCUIT BOARDS. IBM technical disclosure bulletin, 1983, 26 (04): : 1853 - 1854