POTENTIOMETER PACKAGE DESIGN.

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Anon
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| 1600年 / 29期
关键词：
ELECTRONICS PACKAGING - Design;
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摘要：
The commonly-used method for making miniature potentiometer assemblies is to form the leads after attachment to the substrate, as ilustrated, giving rise to handling and other difficulties. Also, the substrate is typically enclosed in a housing with slots to accommodate the leads. Complete sealing of the slots is difficult, leading to leakage of fluids and contaminants during assembly to other surfaces. It is shown how to overcome these problems.
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